PUBLICATION

▶Min Seong Jeong, Jongkyung Park "Research on the Crystallinity of Metal Passivation Layer for Improving Low-Temperature Copper Bonding Performance", The 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2024), Nangang District, Taipei City 11568, Taiwan, Oct. 22-25, 2024


▶Yeonju Kim, Jongkyung Park, "Characterization and Optimization of SiCN films for Low-Temperature Cu Hybrid Bonding", The 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2024), Nangang District, Taipei City 11568, Taiwan, Oct. 22-25, 2024


▶Jihun Kim, Jongkyung Park, "Optimizing Low-Temperature Polymer Thermo Compression Bonding and Polymer Patterning for 3D Multi-Chip Integration", The 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2024), Nangang District, Taipei City 11568, Taiwan, Oct. 22-25, 2024


▶Kyoungmin Shin, Jongkyung Park, "Influence of Current Distribution Variations on Contact Resistance Measurement in Cu-Cu Bonding Interface", The 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2024), Nangang District, Taipei City 11568, Taiwan, Oct. 22-25, 2024


▶ Seonwoo Kim, Jongkyung Park, "The Advanced DC Circuit Model for Hybrid bonding in Dual Damascene Structures", The 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2024), Nangang District, Taipei City 11568, Taiwan, Oct. 22-25, 2024


▶ Hee young Bae, Jong Kyung Park, "Analysis of Program Speed Degradation with ON Pitch Scaling in 3D NAND Flash Memory",  The 31th Korean Conference on Semiconductors (KCS 2024)", Gyeonju Hwabaek International Convention Center (HICO), Korea,  January 24(Wed.)~26(Fri.), 2024. 


▶ Hyeon Seo Yun, Jong Kyung Park, "Enhancing Reliability in 3D NAND Memory: A New Programming for Z-Interference Reduction",  The 31th Korean Conference on Semiconductors (KCS 2024)", Gyeonju Hwabaek International Convention Center (HICO), Korea,  January 24(Wed.)~26(Fri.), 2024. 


▶ Ye Eun Kim, Jong Kyung Park, "Investigation of Z-interference Based on The Confined Nitride Trap Layer Structure in 3D NAND Flash Memory",  The 31th Korean Conference on Semiconductors (KCS 2024)", Gyeonju Hwabaek International Convention Center (HICO), Korea,  January 24(Wed.)~26(Fri.), 2024. 


▶ Jihun Kim, Sang Woo Park, Min Seong Jeong, Yeon Ju Kim and Jong Kyung Park, "Polymer-Dielectric Hybrid Bonding for 3D Multi-chip Stacking Process",  The 31th Korean Conference on Semiconductors (KCS 2024)", Gyeonju Hwabaek International Convention Center (HICO), Korea,  January 24(Wed.)~26(Fri.), 2024. 


▶ Min Seong Jeong, Sang Woo Park, Yeon Ju Kim, Jihun Kim and Jong Kyung Park, "Study on the Crystallinity of Metal Passivation to Improve Low-Temperature Copper Bonding Performance", The 31th Korean Conference on Semiconductors (KCS 2024)", Gyeonju Hwabaek International Convention Center (HICO), Korea,  January 24(Wed.)~26(Fri.), 2024. 


▶Jong Kyung Park, Sang Woo Park, Min Seong Jeong, "Advancements in Metal Passivation Process for Low-Temperature Cu-Cu Direct Bonding",  20th International SoC Conference (ISOCC 2023)", Ramada Plaza Jeju Hotel, Korea, October 25(Wed.)~28(Sat.), 2023. 


▶ Sang Woo Park, Min Seong Jeong, Yeon Ju Kim, Jong Kyung Park, "Low Temperature Cu-Cu Direct Bonding with Ruthenium Passivation Layer",  21st International Symposium on Microelectronics and Packaging (ISMP 2023)", Paradise Hotel Busan, Korea, October 25(Wed.)~27(Fri.), 2023.


▶ Min Seong Jeong, Sang Woo Park, Yeon Ju Kim, Jong Kyung Park, "Understanding the Diffusion Behavior and Chip-Level Bonding for Low-Temperature Copper Hybrid Bonding M",  21st International Symposium on Microelectronics and Packaging (ISMP 2023)", Paradise Hotel Busan, Korea, October 25(Wed.)~27(Fri.), 2023.


▶ Yeon Ju Kim,  Sang Woo Park, Min Seong Jeong, Jong Kyung Park, "The Impact of CMP Process on Cu-SiO2 Hybrid Bonding",  21st International Symposium on Microelectronics and Packaging (ISMP 2023)", Paradise Hotel Busan, Korea, October 25(Wed.)~27(Fri.), 2023.


▶ Ji Hun Kim, Jong Kyung Park, "Polymer-Dielectric Hybrid Bonding for 3D Multi-chip Stacking Process",  21st International Symposium on Microelectronics and Packaging (ISMP 2023)", Paradise Hotel Busan, Korea, October 25(Wed.)~27(Fri.), 2023.
 

▶ 황진경, 박종경, "비대칭 프로그램 패스전압을 이용한 삼차원 낸드플래시의 Z-간섭 개선", 대한전자공학회 2023년도 하계종합학술대회, 롯데호텔 제주(중
문), June 27-29, 2023

 
▶ 김예은, 박종경, "3D NAND에서 confined nitride trap layer 구조에 따른 Z - interference 특성", 대한전자공학회 2023년도 하계종합학술대회, 롯데호텔 제주(중문), June 27-29, 2023

 
▶ 박상우, 박종경, "저온 구리 하이브리드 본딩을 위한 금속 패시베이션 박막의 결정립 크기에 관한 고찰", 마이크로전자 및 패키징 학회지, 수원컨벤션센터, April 4, 2023

 
▶ 정민성, 박종경, "저온 구리 하이브리드 본딩을 위한 금속 확산거동의 원인 고찰, 마이크로전자 및 패키징 학회지", 수원컨벤션센터, April 4, 2023

  

Prior to SeoulTech
 
▶ Jong Kyung Park, Seung-Yoon Kim, Ki-Hong Lee, Seung Ho Pyi, Seok-Hee Lee, and Byung Jin Cho, "Surface-controlled Ultrathin (2 nm) Poly-Si Channel
Junctionless FET towards 3D NAND Flash Memory Applications", Symposium on VLSI Technology, Hawaii, USA, June 9-13, 2014


▶ 박종경, 이석희, 이기홍, 피승호, 조병진, "플래쉬 메모리 소자에서의 초기 VT 불안정 현상 개선에 관한 연구", 20th Korean Conference on Semiconductors,
Hoengsung, Korea, Feb 4-6, 2013
 
▶ 송승민, 박종경, 설원제, 조병진, "그래핀의 work-function 변이에 관한 연구", 20th Korean Conference on Semiconductors, Hoengsung, Korea, Feb 4-6, 2013.
 
▶ Jong Kyung Park, Seok-Hee Lee, Ki-Hong Lee, Seung Ho Pyi, and Byung Jin Cho, " Dramatic Increase of Dielectric Constant of Al2O3 by Very Light Doping
of La and Thermal Treatment and Its Application to Flash Memory Device ", 19th Korean Conference on Semiconductors, Seoul, Korea, Feb. 2012
 
▶ BJ Cho, SM Song, and JK Park, "Issues on Metal Contact and Gate Electrode of Graphene Based FET", The 4th International Conference on Recent
Progress in Graphene Research (RPGR) 2012, p. 26, Beijing, China, Oct. 3-6, 2012 (Invited)
 
▶ Jong Kyung Park, Dong-Il Moon, Yang-Kyu Choi, Seok-Hee Lee, Ki-Hong Lee, Seung Ho Pyi, and Byung Jin Cho, "Origin of transient Vth shift after erase and its impact on 2D/3D structure charge trap Flash memory cell operations", International Electron Devices Meeting, San Francisco, CA, USA, Dec. 10-12, 2012
 
▶ Jong Kyung Park, Seung Min Song, Jeong Hun Mun, and Byung Jin Cho, "Dramatic Improvement of high-K Gate Dielectric Reliability by Replacing Metal Gate Electrode with Mono-Layer Graphene", Symposium on VLSI Technology, Hawaii, USA, Jun. 12-15, 2012
 
▶ Jong Kyung Park, Seung Min Song, Jeong Hun Mun, and Byung Jin Cho, "Graphene Gate Electrode for Advanced Silicon-Based CMOS Devices", Graphene Week 2012, Delft, Netherlands, Jun. 4-8, 2012
 
▶ 송승민, 박종경, 조병진, "금속/그래핀/산화막/반도체 구조에서 그래핀이 커패시턴스에 미치는 영향", 2011 Korean Carbon Society Spring Meeting, Seoul, Korea, May 19-20. 2011


▶ Jong Kyung Park, Youngmin Park, Seok-Hee Lee, Sung Kyu Lim, Jae Sub Oh, Moon Sig Joo, Kwon Hong, and Byung Jin Cho, "Enhancement of High temperature Data Retention by La2O3-Doped Nitride for Charge-Trap Type Flash Memory Device", 18th Korean Conference on Semiconductors, Jeju, Korea, Feb. 2011


▶ Jong Kyung Park, Youngmin Park, Sung Kyu Lim, Jae Sub Oh, Moon Sig Joo, Kwon Hong, and Byung Jin Cho, “In-Depth Study on Mechanism of the Performance Improvement by High Temperature Annealing of the Al2O3 in a Charge-Trap Type Flash Memory Device", International Conference on Solid State Devices and Materials (SSDM), Tokyo, Japan, Sep. 22-24, 2010