▶ Hee young Bae, Jong Kyung Park, "Analysis of Program Speed Degradation with ON Pitch Scaling in 3D NAND Flash Memory", The 31th Korean Conference on Semiconductors (KCS 2024)", Gyeonju Hwabaek International Convention Center (HICO), Korea, January 24(Wed.)~26(Fri.), 2024.
▶ Hyeon Seo Yun, Jong Kyung Park, "Enhancing Reliability in 3D NAND Memory: A New Programming for Z-Interference Reduction", The 31th Korean Conference on Semiconductors (KCS 2024)", Gyeonju Hwabaek International Convention Center (HICO), Korea, January 24(Wed.)~26(Fri.), 2024.
▶ Ye Eun Kim, Jong Kyung Park, "Investigation of Z-interference Based on The Confined Nitride Trap Layer Structure in 3D NAND Flash Memory", The 31th Korean Conference on Semiconductors (KCS 2024)", Gyeonju Hwabaek International Convention Center (HICO), Korea, January 24(Wed.)~26(Fri.), 2024.
▶ Jihun Kim, Sang Woo Park, Min Seong Jeong, Yeon Ju Kim and Jong Kyung Park, "Polymer-Dielectric Hybrid Bonding for 3D Multi-chip Stacking Process", The 31th Korean Conference on Semiconductors (KCS 2024)", Gyeonju Hwabaek International Convention Center (HICO), Korea, January 24(Wed.)~26(Fri.), 2024.
▶ Min Seong Jeong, Sang Woo Park, Yeon Ju Kim, Jihun Kim and Jong Kyung Park, "Study on the Crystallinity of Metal Passivation to Improve Low-Temperature Copper Bonding Performance", The 31th Korean Conference on Semiconductors (KCS 2024)", Gyeonju Hwabaek International Convention Center (HICO), Korea, January 24(Wed.)~26(Fri.), 2024.
▶Jong Kyung Park, Sang Woo Park, Min Seong Jeong, "Advancements in Metal Passivation Process for Low-Temperature Cu-Cu Direct Bonding", 20th International SoC Conference (ISOCC 2023)", Ramada Plaza Jeju Hotel, Korea, October 25(Wed.)~28(Sat.), 2023.
▶ Sang Woo Park, Min Seong Jeong, Yeon Ju Kim, Jong Kyung Park, "Low Temperature Cu-Cu Direct Bonding with Ruthenium Passivation Layer", 21st International Symposium on Microelectronics and Packaging (ISMP 2023)", Paradise Hotel Busan, Korea, October 25(Wed.)~27(Fri.), 2023.
▶ Min Seong Jeong, Sang Woo Park, Yeon Ju Kim, Jong Kyung Park, "Understanding the Diffusion Behavior and Chip-Level Bonding for Low-Temperature Copper Hybrid Bonding M", 21st International Symposium on Microelectronics and Packaging (ISMP 2023)", Paradise Hotel Busan, Korea, October 25(Wed.)~27(Fri.), 2023.
▶ Ji Hun Kim, Jong Kyung Park, "Polymer-Dielectric Hybrid Bonding for 3D Multi-chip Stacking Process", 21st International Symposium on Microelectronics and Packaging (ISMP 2023)", Paradise Hotel Busan, Korea, October 25(Wed.)~27(Fri.), 2023.